Kuo: Apple’s M5 chip to use TSMC’s advanced N3P node; M5 Pro, Max, and Ultra will use a new server-grade SoIC packaging featuring separate CPU and GPU designs (Ben Lovejoy/9to5Mac)

Ben Lovejoy / 9to5Mac:
Kuo: Apple’s M5 chip to use TSMC’s advanced N3P node; M5 Pro, Max, and Ultra will use a new server-grade SoIC packaging featuring separate CPU and GPU designs  —  One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates all the components within a single package.